sectional specification for burn-in sockets used with ball grid array devices for use in electronic equipment 电子设备用带球形式格子排列装置的焊上插孔的分规范
detail specification for burn-in sockets used with ball grid array devices for use in electronic equipment 在电子设备中用的带球形格子排列装置焊上插孔的详细规范
blank detail specification for burn-in sockets used with ball grid array devices for use in electronic equipment 电子设备用的球形格子排列装置的焊上插孔的空白详细规范
detail specification : mechanically actuated zero and low insertion force sockets for pin grid array devices with 2.54 mm 2.54 mm 0.1 " 0.1 " spacing for use in electronic equipment 详细规范:用于电子设备的2.54mmx2.55mm间距针式格子排列装置的零和低插入力机械启动插孔
finally, on the basis of the mpeg-1 layer hencoding hardware structure, the block of logic communicates with the pc over the parallel port and the interface for flash memory are design . then a mpeg audio coding system, which applies to store audio signal, is presented through the field programmable gate array device technology 最后,在mpeg-1层编码的硬件结构的基础上,结合计算机并口通信和flash存储器的接口模块,采用现场可编程逻辑器件fpga技术,最终设计了一种应用于音频信号存储的mpeg音频编码系统。